About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer’s most challenging designs and integrations with industry-leading packaging technologies What You Can Expect* Leverage strong knowledge of developing complex systems like switches, accelerators, AEC and optics to architect complex future package developments

Proven track record of new product introduction from concept, through development and production
Proven track record of technical leadership in the organization
Ability to interact with customers, understand their requirements and develop packaging solutions meeting or exceeding customer expectations
Experience with 2.5D/3D package development is highly desired
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Drive netlists for the package development with tools like ISP (Integrated System Planner) or equivalent tools (XSI or others)
Experience with developing systems with high-speed interfaces like DDR, SERDES and Die2Die interfaces
Strong understanding of Signal and Power Integrity, and EMC issues for IC packages, PCBs and connectors
Knowledge of the thermal and mechanical issues of the IC package development
Ability to work with and drive engineers from different disciplines (SI, PI, Pkg architecture, System design, Assembly, Thermal & Mechanical engineers) to develop market leading packaging solutions
Working knowledge of solving and debugging issues in the lab for high-speed systems
Strong communication, presentation, and documentation skills
A team player

What We're Looking For Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 15-20 years of related professional experience.

Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 12-18 years of experience Expected Base Pay Range (USD) 168,920 - 253,000, $ per annum The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions. Additional Compensation and Benefit Elements Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com. Interview Integrity To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews. These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process. This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment. #LI-MM1

Package Development, Signal Integrity And Power Integrity Engineer, Senior Principal

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